Summary

This project explores four research papers related to advanced semiconductor packaging, materials engineering, and 3D integration. The topics include novel bumpless Chip-on-Wafer (COW) bonding, 2D material integration for power ICs, environmentally friendly dielectric materials for RF interposers, and low-temperature hybrid bonding enabled by layer-transfer technology.

Paper Overview

# Topic Focus
1 COW Bonding Bumpless chip-on-wafer with waffle-wafer structure for 3D integration
2 2D Materials Graphene and ultra-thin films to improve 3D power ICs
3 Non-PFAS Dielectric Photo-imageable dielectric for RF silicon interposers
4 Hybrid Bonding Low-temperature hybrid bonding via layer-transfer technology

Video: Project Paper Summary

This embedded video is the 6.5 minute Zoom summary of the four papers.

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Bibliography Citation:

N. Maleki, A. Hussaddi, D. Mozart, T. Olsson, M. Omareen and F. Ahlgren,
"DeltaBin: An Efficient Binary Data Format for Low Power IoT Devices," 2023 International Conference on Computer, Information and Telecommunication Systems (CITS), Genoa, Italy, 2023, pp. 1–5, doi: 10.1109/CITS58301.2023.10188750.

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