Summary
This study proposes a cost-effective low-temperature hybrid bonding method enabled by layer-transfer technology. The authors show that transferring processed layers onto target wafers can reduce bonding temperature requirements while maintaining strong electrical and mechanical performance. Lower temperatures reduce thermal damage and improve compatibility with various device materials, making the technique appealing for dense 3D integration and advanced packaging.
Key Concepts
Integration Perspective
Lower temperature hybrid bonding helps integrate diverse device materials, including those with mismatched thermal expansion coefficients, without excessive stress.
